Bonding – a Modern Key Technology

Industrial bonding technology is doubtless the joining technology of the future. As a universally utilisable key technology, it’s already meeting extremely exacting demands. Without this innovative, easy to automate joining technology which is at least as good or superior to other techniques in numerous cases, many modern products and applications, ranging from macro to all the way down to nano-technology, would be inconceivable.

Bonding is much more than just joining various materials with greatly differing surface characteristics. Adhesives are used to seal and insulate, serve as encapsulating compounds and transform different materials into composites with extremely high load capacities. Adhesives are used to pre-treat surfaces, and to secure components in production and assembly. Bonding can replace or supplement conventional joining technologies as well.


BONDexpo – the Specialised Trade Fair for Bonding Technology

With the BONDexpo trade fair for industrial bonding technology, trade fair promoters P.E. Schall GmbH & Co. KG have closed a gap in the market – no independent industry showcase for this forward-looking range of topics existed beforehand. BONDexpo was held for the second time at the Stuttgart Exhibition Centre in September 2008. The event’s location at the heart of Baden-Württemberg’s industrial centres and the fact that it’s held concurrent to MOTEK (leading international trade fair for handling and assembly technology) assure ideal conditions for the still young business platform for bonding technology, which is plainly demonstrated by growth experienced between the first and second events.

BONDexpo – All Geared Up for Success

77% growth in exhibitor numbers in 2008 as opposed to the premiere event confirms the need for this specialised trade fair within the industry sector. A total of 108 companies, including market leaders from eight industrialised nations, presented their products and services at the second BONDexpo.
A comprehensive cross-section of the entire spectrum of industrial bonding was exhibited. Beginning with raw materials and pre-treatment of various surfaces, for example with the help of new plasma systems, right on up to the curing of adhesives which harden when exposed to light – BONDexpo 2008 provided comprehensive information regarding the state-of-the-art, as well as insights into the future of bonding technology.

An exhibitor survey conducted at the 2nd BONDexpo indicated that trade fair promoters P.E. Schall GmbH & Co. KG have made the right decision with their concept for BONDexpo. The stated goal of the promoters is to further expand and establish BONDexpo during the course of the years to come.