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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de

Imprint

Technische Betreuung/System:
deutschSix Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de
Exhibitor Statements, Bondexpo 2008

DELO

DELO exhibited for the first time this year at BONDexpo. We’re really satisfied with our first BONDexpo. The combination with MOTEK works very well. We’re also satisfied with the flow of visitors, and the frequency of visits at our booth. We were also able to establish promising new contacts, which is not usually the case for us at trade fairs. For us, trade fairs are mostly for customer care. All in all, our expectations have been fulfilled. It’s good that BONDexpo exists, and it’s important too, because there hasn’t been a comparable industry showcase in the past. More than anything else, our industry is characterised by conventions – but they’re so good and so numerous that I would advise you, as a promoter, to concentrate entirely on the trade fair and not to invest in seminars and presentations at BONDexpo, because there’s enough of that in our industry already.

Inga Schnaidt, DELO Industrie Klebstoffe, Windach, Germany


Henkel Loctite

BONDexpo went extremely well for us. We had high quality visitors. And our new contacts fit nicely into our target group as well – there’ll be lots of work for us after the event ...

Claudia Linder, Henkel Loctite, key account management, distribution industry, Munich, Germany


IFAM

We registered great interest in vocational qualification programs in the field of bonding technology at BONDexpo. If all of the people who demonstrated interest in continuing education at our booth sign up to participate in courses, we’ll certainly have capacity problems. We were also able to provide visitors with lots of basic information, and were surprised how many employees who’ve been involved with practical bonding for years are not yet familiar with concrete qualification offerings in the field of “bonding”. BONDexpo was a big success for us – there aren’t any other comparable trade fairs.

Beate Brede, Fraunhofer Institute‚ Manufacturing Technology, Materials Research IFAM, Bremen, Germany
 


Otto Chemie

We exhibited for the first time this year at BONDexpo, and it was a very positive premiere for us. 90 to 95% of our visitors were industry experts. Of course we still have to evaluate our contacts in detail, but our first impression is very good, and our expectations for BONDexpo have surely been fulfilled. Simultaneous promotion of MOTEK had a positive effect on BONDexpo. We plan to continue supporting BONDexpo.
We would be pleased if more of our competitors could be enlisted to exhibit at BONDexpo.

Rosmarie Stelzl, general management administration, Otto Chemie, Fridolfing, Germany



Don't be too late!
Anmeldung (Bondexpo)
 
at the same time takes place:
Motek
 
Virtual Trade Fair
Virtual Trade Fair
 
Event dates
22.09.2008 – 25.09.2008,
New Exhibition Centre Stuttgart
21.09.2009 – 24.09.2009,
New Exhibition Centre Stuttgart
 
Accomodations
 
product piracy
Produktpiraterie (Bondexpo)