Industrial Bonding Technologies on the Advance

With their industry platform for industrial bonding technologies, namely BONDexpo , trade fair promoters P. E. Schall GmbH & Co. KG have succeeded in establishing a new type of “complementary trade fair” within a very short period of time. BONDexpo will take place for the fourth time in 2010. The event documents the necessity for looking beyond one’s own horizon in an impressive fashion, in order to be able to represent production and assembly technology sequences in their entirety.

Just under 100 exhibitors and 37,500 square feet of overall exhibition floor space at the 3rd BONDexpo in crisis year 2009 substantiate the fact that promoting bonding technologies with a separate trade fair isn’t just an attempt to push a trendy topic, and that the process links between manufacturers and suppliers of bonding, insulating, foam, sealing and encapsulation materials, as well as application equipment, and handling within the respective application, are becoming more and more closely related.

BONDexpo is becoming more and more important as a result, especially in light of the fact that matters involving the fastening and joining of new materials now represent a real bonding technology challenge, and will continue to do so in the future too. After all, lightweight construction isn’t just an issue for motor vehicles, but rather for equipment and devices in general as well. Future materials and material combinations, as well as hybrid solutions, will offer streamlining and resource potential which can only be taken advantage of through the use of new adhesives. The 4th BONDexpo will mediate the state-of-the-art and current know-how between R&D, actual use and materials application.

A separate trade fair for the “bonding technologies niche market”? But of course! Because this is the only way to exploit the many advantages offered by bonding, insulating, foam, sealing and encapsulation technologies to their full extent. Join precision sheet metal components with cold-curing, 2-component adhesives? Substitute soldering with conductive adhesives? Bond hybrid materials made of aluminium and steel or different plastics? Permanently join critical materials with hot-melt bonding technology? Users will receive objective answers to these and many other targeted questions from the exhibitors at the 4th BONDexpo !