The new Stuttgart Exhibition Centre was only recently placed into service for the very first time – with great success – for the doubleheader including BLECHexpo and Schweisstec, and the next trade fair combo presented by P. E. Schall GmbH & Co. KG covering the topics of handling and assembly technology (MOTEK) and industrial bonding technology (Bondexpo) is already in the offing. The trade fair promoters are once again consistently rounding out the process sequences covered by their events, in this case with a sector which appropriately complements assembly technology, namely bonding.

Consistent Rounding Out of Process Sequences
As of immediately, bonding technology will be provided with an outstanding information, communication and procurement platform with international flair in the form of Bondexpo. Especially in light of the fact that MOTEK visitors and exhibitors are above all required to become involved with joining, bonding, insulating and sealing in many of their process steps. In industrial practice, this is accomplished if at all possible with robots and similar application equipment, which is why “taking a look at what the other guys are doing” at the new Stuttgart Exhibition Centre will generate true synergies.

Sorry – All Available Space is Already Booked
And this is exactly how Bondexpo exhibitors appear to see things as well, because all of the space reserved for the premiere edition of Bondexpo in pavilion 7 (part of MOTEK which will be promoted at the same time) is already entirely booked out. Due to the fact that no additional floor space will be available by the time the event takes place from 24 through 27 September 2007, BONDexpo project manager Marc Speidel is truly stuck between a rock and a hard place, because demand for exhibition booths and floor space has already outstripped availability, resulting in a waiting list for 2007.


Premiere with Market and Technology Leaders
Marc Speidel has announced that a whopping 55 companies have registered to date, including 53 exhibitors and co-exhibitors, as well as 2 additionally represented companies. Interest is great at both the national and the international levels, which is underscored by the market and technology leaders from Germany, Switzerland, Spain, the Netherlands and the USA who will participate at the 1st BONDexpo. Participants and pioneers at the initial Bondexpo include internationally active large and mid-sized companies such as 3M, Bühnen, DELO, Hilger & Kern, Netzsch, Panacol-Elosol, Rampf, Reis, Sika, Uhu, Vulkan, Walther, WIWA and the like, so that the 1st Bondexpo will offer a representative selection from current international offerings right from the very start.

Success is Virtually Inevitable
P. E. Schall GmbH & Co. KG and Bondexpo project manager Marc Speidel have done their very best to avoid putting anyone on a waiting list, but an irony of fate has put them on the defensive this time and they’re forced to put off further potential exhibitors until the 2nd Bondexpo in the fall of 2008. There’s no doubt that the 1st Bondexpo, trade fair for industrial bonding technology, which will take place parallel to the 26th MOTEK, international trade fair for handling and assembly technology, will be a complete success, and that the event will establish itself right off the bat.

Further information and logos are available on the Internet at:
www.bondexpo-messe.de

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