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Trade fair catalogue 2011
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Stuttgart Trade Fair Venue
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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de
Imprint
Technische Betreuung/System:
 Six Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de
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Press archive
5th BONDexpo Even Better Established
Whether bonding and adhesives as an alternative technology for joining new hybrids and other materials, high-tech adhesives for production in the solar and photovoltaic industry or water soluble adhesives and encapsulating compounds for...
details
PI 01-11 Bondexpo internet engl.doc (67.5 KB)
30.11.2010
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MOTEK 2010 – Kick-Off for an Automation Boom
The 29th MOTEK international trade fair for assembly, handling and automation technology took place at the Stuttgart Exhibition Centre from the 13th through the 16th of September, 2010. The 4th BONDexpo , trade fair for industrial bonding technology...
details
Motek 10 PI 05 SB internet_engl.doc (73.0 KB)
21.09.2010
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Number One Worldwide
Frickenhausen/Stuttgart, 26 July 2010. More than 900 companies from 23 countries are expected at the Motek international trade fair for assembly and handling technology, which will be held in 5 halls at the Stuttgart Exhibition Centre from the 13th...
details
Motek 10 PI 03 internet_engl.159627.doc (67.5 KB)
26.07.2010
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29th MOTEK and 4th BONDexpo from 13 through 16 September at the Stuttgart Exhibition Centre
The MOTEK international trade fair for assembly and handling technology, as well as the BONDexpo trade fair for industrial bonding technology, are already demonstrating extremely dynamic development at the beginning of 2010, and will thus once again...
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Motek 10 PI 01_engl.doc (81.5 KB)
26.02.2010
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28th MOTEK and 3rd Bondexpo - Successfully Sparks Off Automation Interest
The 2009 German parliamentary elections are over, and are now providing for straightforward political circumstances; MOTEK 2009 is over as well, and has firmed up its clear-cut position as the undisputed number one amongst...
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Bondexpo 09 PI 05_sb_engl.doc (88.0 KB)
29.09.2009
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BONDexpo Resists Crisis Hearsay
With its head held high, the complementary trade fair duo including the 3rd BONDexpo trade fair for industrial bonding technology and the 28th MOTEK international trade fair for handling and assembly technology is withstanding the...
details
Bondexpo 09 PI 04 internet_EN-GB.doc (72.0 KB)
11.08.2009
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BONDexpo 2009 – Bonding Instead of Welding!
The 3rd BONDexpo will continue relentlessly along its course in 2009 as well, and will once again be distinguished by participation of nearly all of the international market leaders, which cannot be entirely taken for granted in the difficult year of...
details
Bondexpo 09 PI 02 de_internet_engl.doc (57.5 KB)
18.04.2009
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BONDexpo Expanding at All Levels!
Now that BONDexpo, since its second edition in the fall of 2008, has become a permanent part of the marketing mix of manufacturers and suppliers of adhesives and sealing compounds, systems, machines and accessories for production, processing and...
details
PI 1_bondexpo_dt_EN-GB.doc (65.5 KB)
02.02.2009
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08.10.2012 – 11.10.2012,
Exhibition Centre Stuttgart
07.10.2013 – 10.10.2013,
Exhibition Centre Stuttgart |
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