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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de

Imprint

Technische Betreuung/System:
deutschSix Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de

Press reports

1  2
6th BONDexpo – Technology Push for Bonding
With the successful establishment of BONDexpo as a trade fair for the fields of bonding, encapsulation, foaming and sealing in production, and above all in assembly processes, private trade fair promoter Paul E. Schall has one again proven his... details

6th BONDexpo – Technology Push for Bonding   PI 01-12 Bondexpo_internet engl.doc (66.0 KB)

 12.01.2012


30th MOTEK and 5th Bondexpo with Record Breaking Visitor Numbers
Whereas some people are getting involved with wild speculations during the course of the Euro crisis, others, namely the real markets, are progressing in a target oriented fashion. The good atmosphere which became apparent at the recent 30th MOTEK... details



 14.10.2011


30th MOTEK with Attractive Supplementary Programme
Within a period of just a few weeks, the MOTEK international trade fair for assembly, handling and automation technology and the BONDexpo trade fair for industrial bonding technologies experienced tremendous growth of more than 100 exhibitors. And... details

30th MOTEK with Attractive Supplementary Programme   PI 05-11 Motek_internet engl.doc (61.0 KB)

 09.09.2011


30th MOTEK with Attractive Supplementary Programme
Within a period of just a few weeks, the MOTEK international trade fair for assembly, handling and automation technology and the BONDexpo trade fair for industrial bonding technologies experienced tremendous growth of more than 100 exhibitors. And... details

30th MOTEK with Attractive Supplementary Programme   PI 04-11 Motek_internet engl.doc (60.5 KB)

 28.06.2011


30th MOTEK and 5th BONDexpo – Assembly, Handling and More …
  Alone the naked figures, which are no less impressive as a result, speak for themselves: more than 750 exhibitors and 310,000 square feet of net exhibition floor space for MOTEK, plus just under an additional 100 exhibitors and more than... details

30th MOTEK and 5th BONDexpo – Assembly, Handling and More …   PI 03-11 Motek internet engl..doc (60.5 KB)

 11.05.2011


Lasting Success for BONDexpo
BONDexpo Established as Industry Meeting PlacePositioned as a complementary technical trade fair for production and assembly automation at MOTEK, the trade fair duo consisting of the 27th MOTEK and the 2nd BONDexpo was in top form once again in the... details

Lasting Success for BONDexpo   bondexpo_sb_2008_internet_engl.doc (85.0 KB)

 01.10.2008


2nd BONDexpo with Strong Growth
BONDexpo 2008 – the trade fair for industrial bonding technology will take place at the Stuttgart Exhibition Centre from the 22nd through the 25th of September, and is experiencing strong growth in exhibitor numbers and occupied floor space. ... details

2nd BONDexpo with Strong Growth   Bondexpo - Presseinformation2 - internet - Engl - Mai08.doc (81.0 KB)

 27.05.2008


1st BONDEXPO at the New Stuttgart Exhibition Centre
The new Stuttgart Exhibition Centre was only recently placed into service for the very first time – with great success – for the doubleheader including BLECHexpo and Schweisstec, and the next trade fair combo presented by P. E. Schall GmbH & Co. KG... details

Press Information 3 Bondexpo 2007   BX_PI3_100707_gb_internet.doc (77.0 KB)

 11.07.2007


1  2

Event dates
08.10.2012 – 11.10.2012,
Exhibition Centre Stuttgart

07.10.2013 – 10.10.2013,
Exhibition Centre Stuttgart
 
Virtual Trade Fair
Virtual Trade Fair
 
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product piracy
Produktpiraterie (Bondexpo)