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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de

Imprint

Technische Betreuung/System:
deutschSix Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de
Press reports

Lasting Success for BONDexpo
BONDexpo Established as Industry Meeting PlacePositioned as a complementary technical trade fair for production and assembly automation at MOTEK, the trade fair duo consisting of the 27th MOTEK and the 2nd BONDexpo was in top form once again in the... details

Lasting Success for BONDexpo   bondexpo_sb_2008_internet_engl.doc (85.0 KB)

 01.10.2008


2nd BONDexpo with Strong Growth
BONDexpo 2008 – the trade fair for industrial bonding technology will take place at the Stuttgart Exhibition Centre from the 22nd through the 25th of September, and is experiencing strong growth in exhibitor numbers and occupied floor space. ... details

2nd BONDexpo with Strong Growth   Bondexpo - Presseinformation2 - internet - Engl - Mai08.doc (81.0 KB)

 27.05.2008


1st BONDEXPO at the New Stuttgart Exhibition Centre
The new Stuttgart Exhibition Centre was only recently placed into service for the very first time – with great success – for the doubleheader including BLECHexpo and Schweisstec, and the next trade fair combo presented by P. E. Schall GmbH & Co. KG... details

Press Information 3 Bondexpo 2007   BX_PI3_100707_gb_internet.doc (77.0 KB)

 11.07.2007


1st BONDEXPO – Trade Fair for the Up-and-Coming Bonding Technology Market
With “industrial bonding technology” as a core topic, renowned trade fair promoters P. E. Schall GmbH & Co. KG are once again penetrating a promising technology segment, which has amounted to only a peripheral aspect at other (technical) trade fairs... details

1st BONDEXPO – Trade Fair for the Up-and-Coming Bonding Technology Market   BX_PI2_210207_Internet_engl_GB.doc (77.0 KB)

 21.02.2007


1st BONDEXPO – Trade Fair for Industrial Bonding Technology
The 1st BONDEXPO, trade fair for industrial bonding technology, will take place at the new Stuttgart Exhibition Centre from the 24th through the 27th of September, 2007. In launching this new, long awaited event, trade fair promoters P. E. Schall... details

1. BONDEXPO – Fachmesse für industrielle Klebetechnologie   BX_PI1_190906 gb_internet.doc (162.5 KB)

 22.09.2006


online order system
Online-Order-Service
 
Sonderschau klebtechnische Weiterbildung
Sonderschau klebtechnische Weiterbildung (Bondexpo)
 
 
at the same time takes place:
Motek
 
Event dates
22.09.2008 – 25.09.2008,
New Exhibition Centre Stuttgart
21.09.2009 – 24.09.2009,
New Exhibition Centre Stuttgart
 
Accomodations
 
product piracy
Produktpiraterie (Bondexpo)