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Trade fair catalogue 2011
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Stuttgart Trade Fair Venue
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Technical responsibility: P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0 Fax: 07025 / 9206-620 E-Mail:info@schall-messen.de
Imprint
Technische Betreuung/System:
Six Offene Systeme GmbH
Am Wallgraben 99 70565 Stuttgart
E-Mail: info@six.de
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Press reports
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6th BONDexpo – Technology Push for Bonding
With the successful establishment of BONDexpo as a trade fair for the fields of bonding, encapsulation, foaming and sealing in production, and above all in assembly processes, private trade fair promoter Paul E. Schall has one again proven his...
details
PI 01-12 Bondexpo_internet engl.doc (66.0 KB)
12.01.2012
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30th MOTEK and 5th Bondexpo with Record Breaking Visitor Numbers
Whereas some people are getting involved with wild speculations during the course of the Euro crisis, others, namely the real markets, are progressing in a target oriented fashion. The good atmosphere which became apparent at the recent 30th MOTEK...
details
14.10.2011
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30th MOTEK with Attractive Supplementary Programme
Within a period of just a few weeks, the MOTEK international trade fair for assembly, handling and automation technology and the BONDexpo trade fair for industrial bonding technologies experienced tremendous growth of more than 100 exhibitors. And...
details
PI 05-11 Motek_internet engl.doc (61.0 KB)
09.09.2011
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30th MOTEK with Attractive Supplementary Programme
Within a period of just a few weeks, the MOTEK international trade fair for assembly, handling and automation technology and the BONDexpo trade fair for industrial bonding technologies experienced tremendous growth of more than 100 exhibitors. And...
details
PI 04-11 Motek_internet engl.doc (60.5 KB)
28.06.2011
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30th MOTEK and 5th BONDexpo – Assembly, Handling and More …
Alone the naked figures, which are no less impressive as a result, speak for themselves: more than 750 exhibitors and 310,000 square feet of net exhibition floor space for MOTEK, plus just under an additional 100 exhibitors and more than...
details
PI 03-11 Motek internet engl..doc (60.5 KB)
11.05.2011
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Lasting Success for BONDexpo
BONDexpo Established as Industry Meeting PlacePositioned as a complementary technical trade fair for production and assembly automation at MOTEK, the trade fair duo consisting of the 27th MOTEK and the 2nd BONDexpo was in top form once again in the...
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bondexpo_sb_2008_internet_engl.doc (85.0 KB)
01.10.2008
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1st BONDEXPO at the New Stuttgart Exhibition Centre
The new Stuttgart Exhibition Centre was only recently placed into service for the very first time – with great success – for the doubleheader including BLECHexpo and Schweisstec, and the next trade fair combo presented by P. E. Schall GmbH & Co. KG...
details
BX_PI3_100707_gb_internet.doc (77.0 KB)
11.07.2007
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08.10.2012 – 11.10.2012,
Exhibition Centre Stuttgart
07.10.2013 – 10.10.2013,
Exhibition Centre Stuttgart |
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