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Stuttgart Trade Fair Venue
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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de
Imprint
Technische Betreuung/System:
 Six Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de
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Press reports
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29th MOTEK and 4th BONDexpo from 13 through 16 September at the Stuttgart Exhibition Centre
The MOTEK international trade fair for assembly and handling technology, as well as the BONDexpo trade fair for industrial bonding technology, are already demonstrating extremely dynamic development at the beginning of 2010, and will thus once again...
details
Motek 10 PI 01_engl.doc (81.5 KB)
26.02.2010
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28th MOTEK and 3rd Bondexpo - Successfully Sparks Off Automation Interest
The 2009 German parliamentary elections are over, and are now providing for straightforward political circumstances; MOTEK 2009 is over as well, and has firmed up its clear-cut position as the undisputed number one amongst...
details
Bondexpo 09 PI 05_sb_engl.doc (88.0 KB)
29.09.2009
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BONDexpo Resists Crisis Hearsay
With its head held high, the complementary trade fair duo including the 3rd BONDexpo trade fair for industrial bonding technology and the 28th MOTEK international trade fair for handling and assembly technology is withstanding the...
details
Bondexpo 09 PI 04 internet_EN-GB.doc (72.0 KB)
11.08.2009
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BONDexpo 2009 – Bonding Instead of Welding!
The 3rd BONDexpo will continue relentlessly along its course in 2009 as well, and will once again be distinguished by participation of nearly all of the international market leaders, which cannot be entirely taken for granted in the difficult year of...
details
Bondexpo 09 PI 02 de_internet_engl.doc (57.5 KB)
18.04.2009
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BONDexpo Expanding at All Levels!
Now that BONDexpo, since its second edition in the fall of 2008, has become a permanent part of the marketing mix of manufacturers and suppliers of adhesives and sealing compounds, systems, machines and accessories for production, processing and...
details
PI 1_bondexpo_dt_EN-GB.doc (65.5 KB)
02.02.2009
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Lasting Success for BONDexpo
BONDexpo Established as Industry Meeting PlacePositioned as a complementary technical trade fair for production and assembly automation at MOTEK, the trade fair duo consisting of the 27th MOTEK and the 2nd BONDexpo was in top form once again in the...
details
bondexpo_sb_2008_internet_engl.doc (85.0 KB)
01.10.2008
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1st BONDEXPO at the New Stuttgart Exhibition Centre
The new Stuttgart Exhibition Centre was only recently placed into service for the very first time – with great success – for the doubleheader including BLECHexpo and Schweisstec, and the next trade fair combo presented by P. E. Schall GmbH & Co. KG...
details
BX_PI3_100707_gb_internet.doc (77.0 KB)
11.07.2007
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13.09.2010 – 16.09.2010,
New Exhibition Centre Stuttgart |
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