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Stuttgart Trade Fair Venue
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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de
Imprint
Technische Betreuung/System:
 Six Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de
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Bonding Technology – Economic, High-Tech Joining Technology of the Future:
The 3rd BONDexpo, trade fair for industrial bonding technology, will continue relentlessly along its course in 2009 as well, and will once again be distinguished by participation of nearly all of the international market leaders, which can’t be...
details
01.05.2009
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BONDexpo Gets Ready for the Third Round:
For the third time, the BONDexpo trade fair for bonding technology will open its doors at the Stuttgart Exhibition Centre from the 21st through the 24th of September, 2009. Promoted concurrently to MOTEK, the world’s leading automation trade...
details
04.04.2009
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The New Bondexpo Trade Fair for Industrial Bonding Technology from 24 to 27 September 2007 at the New Stuttgart Exhibition Centre
Ever since trade fair promoter Paul E. Schall announced that a new specialised trade fair for industrial bonding technology will take place concurrent to Motek, project manager Marc Speidel’s telephone has been ringing off the hook. “Interest is...
details
13.10.2006
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| Stuttgart |
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13.09.2010 – 16.09.2010,
New Exhibition Centre Stuttgart |
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