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Number One Worldwide, Number One Worldwide   Motek 10 PI 03 internet_engl.159627.doc (67.5 KB)



Number One Worldwide

The Motek-Microsys-Bondexpo trade fair trio is ready for take-off.

Frickenhausen/Stuttgart, 26 July 2010. More than 900 companies from 23 countries are expected at the Motek international trade fair for assembly and handling technology, which will be held in 5 halls at the Stuttgart Exhibition Centre from the 13th through the 16th of September, 2010. Nearly 100 exhibitors from seven countries have registered to participate at the Bondexpo trade fair for industrial bonding technology, which will take place concurrently. The 4th Microsys trade fair for micro and nano-technology will be held as well as a third trade fair highlight. A total of roughly 323,000 square feet of net exhibition floor space will be occupied this year. 31,000 expert visitors attended in 2009, of whom 15% came from outside of Germany. The trade fair’s main focal point involves solutions with which companies are able to automate, and thus streamline their processes.

For the first time ever, the “Arena of Innovation” (AOI) will take place as part of the supplementary programme at this year’s Motek. This new forum for the presentation of innovations has been mutually conceived by the Mechatronics Competence Network BW, the Fraunhofer Institute for Production Technology and Automation (IPA) and trade fair promoters P. E. Schall GmbH & Co. KG. Ideas from industry and science will be developed into innovations by means of the AOI platform. The goal is to create products and services with strong potential for subsequent economic success.

The Mechatronics Competence Network BW will organise two theme parks: the Mechatronics Theme Park at which companies will present mechatronic solutions for production and assembly automation, and the Training & Research Theme Park which is dedicated to training and vocational education for qualified personnel. Universities, as well as institutes such as the German federal labour agency, will be mutually involved.




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at the same time takes place:
Stuttgart
Bondexpo
 
Virtual Trade Fair
Virtual Trade Fair
 
Event dates
13.09.2010 – 16.09.2010,
New Exhibition Centre Stuttgart

10.10.2011 – 13.10.2011,
New Exhibition Centre Stuttgart

08.10.2012 – 11.10.2012,
New Exhibition Centre Stuttgart
 
 
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product piracy
Produktpiraterie (Bondexpo)
 
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