Already today – 7 months before they open – MOTEK and BONDexpo have enlisted just under 700 exhibitors, and firm bookings have already been received for roughly 270,000 square feet of net exhibition floor space!

The MOTEK international trade fair for assembly and handling technology, as well as the BONDexpo trade fair for industrial bonding technology, are already demonstrating extremely dynamic development at the beginning of 2010, and will thus once again live up to their reputation as a leading international trend barometer. With currently 620 exhibitors occupying 258,000 square feet of net floor space, and 55 exhibitors occupying 15,000 square feet of net floor space respectively, the two events are well on the way and will certainly break the thousand mark before the event opens in fall 2010!

MOTEK with Distinguishing Attribute

And thus MOTEK, internationally recognised as a leading trade fair, is leaving the competition even further behind, especially in light of the fact that despite the difficult times expected in 2010, more and more robot manufacturers and robot integrators are deciding in favour of MOTEK as their most important information, business and marketing platform. At the same time, the long-term strategy of establishing BONDexpo as a complementary trade fair is also paying off, which will take place concurrent to MOTEK for the fourth time already, and which alone is expected to draw more than 100 exhibitors.

BONDexpo Expands the Process Sequence

The influx of robotics technology, which was scarcely hoped for in its current form, can be traced back to a considerable extent to the fact that users don’t want to look at robots in an “isolated” fashion as some sort of universally exploitable machine, but rather as an integrated building block in automated production, assembly and material flow solutions. Like no other trade fair in the world, MOTEK – and BONDexpo as a supplement including, amongst other technologies, robot aided bonding etc. – presents comprehensive worldwide offerings covering components, modules, subsystems and complete solutions for production and assembly automation, each in a strictly applications-related manner!
 

Meeting Future Challenges

For trade fair promoter Paul E. Schall and longstanding project manager Rainer Bachert, it’s only logical that the users and their experts think and act in terms of closed process sequences more consistently than ever before, because this is the only way to fully exploit all relevant streamlining effects. For this reason, the 29^th MOTEK and the 4^th BONDexpo will not only once again be accompanied by the time-tested exhibitor forum, theme parks and special shows: Entirely new approaches will also be explored with a relaunch of the MICROSYS trade fair for micro and nano-technology in R&D, production and applications engineering.

Trend Topic: Assembly in Micro-Technology

After all, one of our current challenges, which will take on even more significance in the future, is certainly the development and production of manufacturing and assembly automation methods specifically for microsystems technology – a field for which MOTEK exhibitors are plainly predestined! For this reason, the 4^th MICROSYS, although interrupted in the past, will take place concurrent to MOTEK and BONDexpo at the Stuttgart Exhibition Centre from the 13^th through the 16^th of September, 2010. As a result, in-depth insights will be presented to exhibitors, users and expert visitors into the assembly technologies of the future, which will be distinguished to an ever greater extent by miniaturisation based on efforts to promote the efficient use of resources by means of material efficiency and functions integration.

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