With its head held high, the complementary trade fair duo including the 3rd BONDexpo trade fair for industrial bonding technology and the 28th MOTEK international trade fair for handling and assembly technology is withstanding the continuous, nerve-racking hearsay regarding the economic crisis. Together, the two trade fairs momentarily represent exactly 999 exhibitors from a total of 21 countries, just under 10% of whom will be located in the BONDexpo area in hall 7. The respective companies and institutions are thus plainly demonstrating their presence, especially in light of the fact that the small but powerful BONDexpo sees itself as an event that ideally complements MOTEK, which concerns itself primarily with assembly technology, and thus of course joining as well. Conversely, reproducible quantities of insulating, foaming, sealing and encapsulating materials need to be applied with high positioning accuracy, for which MOTEK offers suitable handling and robot application systems.
BONDexpo = Bonding, Insulation, Foaming, Sealing, Encapsulation ...
As announced by BONDexpo project management not only are the relevant market players interested in, and above all committed to BONDexpo. In particular institutions such as the Bonding Technologies and Surfaces Division of the Fraunhofer Institute for Manufacturing Technology and Applied Materials Research in Bremen (IFAM) and the Bonding Technology Centre, a technical bonding school of the DVS, are actively working on the layout of the information and communication aspects of BONDexpo, and will offer various special shows covering both theory and actual practice. And thus within a very short period of time, BONDexpo has evolved into the industry event, and is a permanent fixture within the marketing mix of manufacturers and suppliers which also provides users with their most important information, communication and procurement platform.
BONDexpo = a Closed Process Sequence from Materials, Right On Up to Application
Automatable application solutions deserve special attention this year, in order to further increase assembly efficiency when joining and bonding materials of equal hardness, or different materials. Due to the fact that new materials, or so-called hybrid materials, can no longer be reliably and economically joined and fastened with conventional technologies, adhesives, as well as joining techniques which combine adhesives and mechanical means, are becoming more and more common. Automation solutions are favoured in order to keep labour and application expenses as low as possible in this area. BONDexpo presents the adhesives, as well as the dosing and application equipment required to this end, and numerous MOTEK exhibitors provide the required coordinate handling systems and industrial robots. And thus the synergistic effects of the two trade fairs, namely BONDexpo and MOTEK which will take place simultaneously at the Stuttgart Exhibition Centre from 21 through 24 September 2009, come full circle.
Six Offene Systeme GmbH
