Bonding Technology – Economic, High-Tech Joining Technology of the Future:
3rd BONDexpo, 21 to 24 Sept. 2009, Stuttgart Exhibition Centre
The 3rd BONDexpo, trade fair for industrial bonding technology, will continue relentlessly along its course in 2009 as well, and will once again be distinguished by participation of nearly all of the international market leaders, which can’t be taken for granted in the difficult year of 2009. Nevertheless, problems always present opportunities, and one of these is the increasing use of bonding technology as a process for joining modern automotive materials, as well as for insulating and sealing, because the trend towards “bonding instead of welding” is gaining more and more momentum amongst the automobile manufacturers and their suppliers, an alternative which not only offers technical advantages, but rather concrete benefits for production and thus economic efficiency as well.
Bonding is More Efficient and Economical
For Marc Speidel, BONDexpo project manager, it’s plain to see that no one who wants to remain competitive both today and in the future will be able to escape these new developments. And according to Speidel, that’s why significantly more manufacturers of robots and adhesive application systems will participate at the 3rd BONDexpo trade fair for industrial bonding technology which, as always, will take place concurrent to MOTEK, leading international trade fair for handling and assembly technology – especially in light of the fact that they feel quite comfortable in this setting. The unique constellation of the trade fair duo comprised of BONDexpo and MOTEK, i.e. presenting bonding, insulating, foaming and sealing systems in direct connection with application equipment and robotics systems, is a convincing concept – in particular in the year 2009.
More than 50 renowned market players have registered in the meantime. In addition to this, the trade fair programme will be rounded out with the special show entitled “Training in the Field of Bonding Technology” presented by Fraunhofer IFAM (Bremen) and the TechnologieCentrum Kleben (technology centre for bonding) . Originally earmarked floor space in hall 7 is thus already fully occupied.
And thus the 3rd BONDexpo will do more than just assert itself in 2009, because modern adhesive bonds are just as much a part of the future as are the current hybrid solutions, and these technologies and processes will by no means be limited to the automobile manufacturers and their suppliers.
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Six Offene Systeme GmbH
