Bondexpo 09 PI 02 de_internet_engl.doc (57.5 KB)
BONDexpo 2009 – Bonding Instead of Welding!
More than 50 renowned market players, increasing coverage of robots and applications, two special shows presented by Fraunhofer IFAM from Bremen and the TechnologieCentrum Kleben (technology centre for bonding) result in full occupancy of all earmarked floor space in pavilion 7.
The 3rd BONDexpo will continue relentlessly along its course in 2009 as well, and will once again be distinguished by participation of nearly all of the international market leaders, which cannot be entirely taken for granted in the difficult year of 2009. Nevertheless, problems always present opportunities, and one of these is the increasing use of bonding technology as a process for joining modern automotive materials, as well as for insulating and sealing. After all, the trend towards “bonding instead of welding” is gaining more and more momentum amongst the automobile manufacturers and their suppliers, an alternative which not only offers technical advantages, but rather concrete benefits for production and thus economic efficiency as well.
Bonding is More Efficient and Economical
For Marc Speidel, BONDexpo project manager, it’s plain to see that no one will be able to escape these new developments if he wants to remain competitive both today and in the future. And according to Speidel, that’s why significantly more manufacturers of robots and adhesive application systems will participate at the 3rd BONDexpo trade fair for industrial bonding technology which, as always, will take place concurrent to MOTEK, leading international trade fair for handling and assembly technology – especially in light of the fact that they feel quite comfortable in this setting. The unique constellation of the trade fair duo comprised of BONDexpo and MOTEK, i.e. presenting bonding, insulating, foaming and sealing systems in direct proximity to application equipment and robotics systems, has convinced exhibitors and expert visitors from all over the world and will continue to do so in 2009.
Streamlining Effects Thanks to Robot-Aided Adhesive Application
Other aspects of bonding technology will provide impetus as well, because photovoltaic and solar modules can be manufactured more simply and less expensively with the help of adhesives and sealing compounds, for which reason efficient processes and application solutions are in demand in this respect. And thus product and information offerings presented at BONDexpo and MOTEK once again come full circle, because high performance robotics and handling systems are absolutely essential for reliable, high quality application of adhesives and sealing compounds for the comparatively large modules.
New Markets Well Within Reach
Seen in this light, the BONDexpo trade fair for industrial bonding technology will not only fulfil its role as a mediator, it will also function as a sort of economic engine by promoting the use of robots and handling systems for the production of photovoltaic components and solar modules. At any rate, the 3rd BONDexpo will do more than just assert itself in 2009, because modern adhesive bonds are just as much a part of the future as are current hybrid solutions, and these technologies and processes will by no means be limited to the automobile manufacturers and their suppliers.
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