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Trade fair catalogue 2010
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Stuttgart Trade Fair Venue
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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de
Imprint
Technische Betreuung/System:
 Six Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
E-Mail: info@six.de
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BONDexpo Gets Ready for the Third Round:
Trade Fair for Bonding Technology Addresses the Industry’s Key Topics with Concentrated Technical Expertise
For the third time, the BONDexpo trade fair for bonding technology will open its doors at the Stuttgart Exhibition Centre from the 21st through the 24th of September, 2009. Promoted concurrently to MOTEK, the world’s leading automation trade fair, BONDexpo is integrated into an ideal setting, allowing both events to profit from numerous synergies.
Industrial bonding technology is present in nearly all areas of life in our modern world, and will develop even more potential in the future. If all of the components in today’s airplanes and automobiles which are secured by means of high-tech bonding processes were removed, the entire construction would simply collapse. Even aircraft wings can be assembly today through the use of bonding technology. These developments, as well as rapid growth of the market, assure the young BONDexpo trade fair promising potential for the future.
In order to ideally prepare the event for its task as a central information platform, the world-class exhibitor council with renowned representatives from the industry has been providing project manager Marc Speidel with advice and support since the beginning of the year. This assures that the needs of both exhibiters and visitors are fulfilled in an ideal fashion, and that solutions for the industry’s key questions are pointed out. Bonding, sealing and insulation – the range of offerings presented at the 3rd BONDexpo will once again draw the attention of the experts to Stuttgart, and continue to expand their significance in the marketing mix of the respective manufacturers and suppliers. Up-to-the-minute topics covered by special shows and a practically oriented exhibitor forum will round out the highly convincing trade fair programme at the 3rd BONDexpo.
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| at the same time takes place: |
| Stuttgart |
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13.09.2010 – 16.09.2010,
New Exhibition Centre Stuttgart
10.10.2011 – 13.10.2011,
New Exhibition Centre Stuttgart
08.10.2012 – 11.10.2012,
New Exhibition Centre Stuttgart |
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