PI 1_bondexpo_dt_EN-GB.doc (65.5 KB)
BONDexpo Expanding at All Levels!
BONDexpo founds exhibitor advisory board; renowned companies demonstrate commitment to BONDexpo as industry and business platform; bonding technologies as an innovation driver
Now that BONDexpo, since its second edition in the fall of 2008, has become a permanent part of the marketing mix of manufacturers and suppliers of adhesives and sealing compounds, systems, machines and accessories for production, processing and application, as well as peripherals and services, further expansion is on the agenda for 2009! As a result, trade fair promoters P. E. Schall GmbH & Co. KG have founded an exhibitor advisory board whose initial members comprise the following renowned industry representatives: Diener electronic GmbH + Co. KG, DELO Klebstoffe GmbH & Co. KG, Hilger und Kern GmbH, Rampf Holding GmbH & Co. KG and Sika Deutschland GmbH.
With the formation of the exhibitor advisory board, P.E. Schall will not only continue a highly successful tradition which has been successful for many years, because having a seat and a vote in the exhibitor advisory board certainly carries a good deal of weight where further development of BONDexpo is concerned with regard to the incorporation of complimentary sectors into the nomenclature, the presentation of special shows and industry events, and expanded trade fair marketing. The exhibitor advisory board is thus by no means just a “decorative embellishment”, but rather will provide project manager Marc Speidel and his team with active support in organising BONDexpo 2009, and further events far into the future.
The necessity for the exhibitor advisory board results alone from the rapid growth being experienced by the market, and in turn BONDexpo as well in its function as an industry meeting place. And thus considerably greater significance will be placed upon bonding technologies as of immediately because, for example, modern lightweight automotive engineering would no longer be conceivable at all without bonding technology and hybrid joining solutions which combine mechanical joining with adhesives or sealing materials. Finally, the current economic situation is not only forcing the automobile manufacturers and their suppliers to think about how concepts like reduced energy consumption, energy efficiency, lightweight engineering, crash safety, ease of repair, cost reductions and subsequent materials recycling can be reconciled as quickly as possible to an ever greater extent. And this, once again, immediately brings the bonding technologies into play, whose latest developments and application options will be presented in the world’s most comprehensive fashion at BONDexpo 2009!
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