bondexpo_sb_2008_internet_engl.doc (85.0 KB)
Lasting Success for BONDexpo
Already at its second event, the BONDexpo trade fair for industrial bonding technologies has been able to establish itself as an industry meeting place for manufacturers and suppliers of adhesives and sealing compounds, equipment, production machinery and accessories, processing and application, as well as peripherals and services. And thus private trade fair promoter P. E. Schall GmbH & Co. KG has created yet another high-tech trade fair for the new technology exhibition centre in Stuttgart, which will continue to grow in the years to come, in the same manner as has also been the case with the MOTEK international trade fair for handling and assembly technology.
BONDexpo Established as Industry Meeting Place
Positioned as a complementary technical trade fair for production and assembly automation at MOTEK, the trade fair duo consisting of the 27th MOTEK and the 2nd BONDexpo was in top form once again in the fall of 2008, and upon closing announced the impressive numbers including more than 36,000 international expert visitors. This figure, which is just slightly less than last year’s the record breaking number of expert visitors (approx. 38,000) is certainly no coincident, because the 2nd BONDexpo, now with 108 exhibitors from 9 industrialised nations, presented itself with great self-confidence in its own pavilion 8 at the new Stuttgart Exhibition Centre, which was nearly filled to the brim.
Niche Industry Puts Itself into the Limelight
Not only the international market leaders for adhesives and sealants, but rather internationally active companies in the field of automated application technology as well, put themselves into the limelight at the 2nd BONDexpo to a greater extent than ever before, and reported great numbers of RFQs from visitors who were interested in concrete solutions in response to a random, preliminary exhibitor survey. 77% growth in exhibitor numbers and a 74% increase in booked exhibition floor space announced in advance caused a great stir, as did the comparatively large numbers of new developments and world’s first exhibited at the event, including 15 products presented for the first time anywhere.
In Focus: New Materials and Automated Application
Worthy of emphases in this respect are the so-called ECO polyurethane materials made of renewable, “green” raw materials (Danquinsa GmbH), special application techniques based on robots (Reis GmbH), application cells with a coordinate motion system and the ability to apply up to four components (Rampf-Gruppe), as well as fast (re)acting super-glues which withstand vibration and impact, and can be used within a very broad range of temperatures from -50 to +100° C (Uhu GmbH). The innovation tempo appears to be very fast paced in this industry, and the user are anxious to see what the suppliers will pull out of their hats at the next BONDexpo trade fair for industrial bonding technology which will, of course, once again take place at the Stuttgart Exhibition Centre from the 21st through the 24 of September, 2009.
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Six Offene Systeme GmbH
