BONDexpo 2008 – the trade fair for industrial bonding technology will take place at the Stuttgart Exhibition Centre from the 22nd through the 25th of September, and is experiencing strong growth in exhibitor numbers and occupied floor space.

Already at its second edition, BONDexpo is meeting with more than just good approval and is exceeding results achieved at the premiere event! More than 4 months before the event opens its doors, BONDexpo’s enterprising project manager, Marc Speidel, is able to announce figures which could hardly have been anticipated for bonding technology, despite the fact that the trade fair will be held concurrent to the MOTEK international trade fair for handling and assembly technology: With just under 80 exhibitors currently registered for the event, 24% growth is being experienced in comparison with the “first round”, and the growth rate for occupied floor space is currently 60% as compared with 2007.

The Audacity to Fill the Gap – Developing New Markets
Without a doubt, the BONDexpo trade fair for bonding technology is pushing its way into an interesting niche, out of which a new market will evolve as a result of technological necessity. Automobile and lightweight machinery manufacturing would be entirely impossible without bonding, foaming, encapsulation, sealing and insulating technology, because the required levels of stability and durability can only be attained by means of an homogeneous composite. The engineers not only need to be made aware of potential alternative material and joining solutions, for which reason, for example, an informative special show on the subject of “Bonding in Automobile and Vehicle Manufacturing” will be organised for the 2nd BONDexpo, which will also point out concrete solutions.

Theory Meets Practical Application
The second special show will be dedicated to the issue of “Vocational Education in the Field of Bonding Technology”.
Continuing education options for various vocations, as well as knowledge and know-how based upon implemented production processes which make use of adhesives, will be presented here, and experience from the areas of research and training will be imparted. This internationally unique special show will be actively supported by the Bonding Technology Centre and the IFAM Fraunhofer Institute for Manufacturing Technology and Applied Materials Research. Practice oriented special shows of this type often do away with one or the other well established preconception, for example that economy and ecology cannot be reconciled with bonding technology. Because, as mentioned above, automobile and lightweight machinery manufacturing would be impossible without bonding technology!

The applications are coming!
BONDexpo’s success is also demonstrated by the fact that, at the first as well as the second event, a large percentage of the exhibitors come from the application equipment sector, above all including the relevant robot manufacturers. After all, robots are now applying adhesives and insulating materials in a big way in the field of automobile and vehicle manufacturing, for which reason their competence will be demonstrated to the targeted visitor group. Seen in this light, the two industry trade fairs, BONDexpo and MOTEK, enter into an ideal symbiosis, especially since the expert visitors don’t have to attend two separate events.

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