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Technical responsibility:
P.E. Schall GmbH & Co. KG
Tel: 07025 / 9206-0
Fax: 07025 / 9206-620
E-Mail:info@schall-messen.de

Imprint

Technische Betreuung/System:
deutschSix Offene Systeme GmbH
Am Wallgraben 99
70565 Stuttgart
Email: info@six.de
Bondexpo – Trade Fair for Industrial Bonding Technology - The complete technology for bonding and joining parts

Bondexpo

Bonding – the motor for innovative joining technology
The problem of joining pieces together through bonding - whether they are of the same material or of different materials - is as old as joining technology itself. Modern-day adhesive technology has established itself in all areas of industrial production and assembly as a bonding process solution that is of equal, if not superior standing and which can easily be implemented as an automated process. Gone are the days when it was “only” regarded as an alternative to conventional mechanical joining and adhesive technologies.

Bonding – joins, seals and protects
Bonding involves a lot more than simply connecting different materials with diverse surface structures. Adhesives seal and insulate, serve as joint sealing compounds and turn a variety of materials into highly-resistant composite materials. Adhesives are used for the priming of surfaces and are used in production and assembly to fix and hold items in place. Bonding is able to replace common joining technologies and, combined with clinch and other joining technologies, enables the lightweight construction of the motorcar industry.

Bondexpo – the platform for adhesive technology
The importance of adhesives and adhesive technologies as a construction element in the area of joining and its extended functions is totally underestimated to this day. The same can be said about the possibilities for rationalisation that the use of adhesives and adhesive technology opens up. The new expert trade fair Bondexpo looks at these issues and for the first time presents the entire world of adhesive technology to an expert audience.

Bondexpo – sector meeting where “lasting bonds are made”
The new trade fair Bondexpo has been designed to be a practical sector get-together, intended to introduce customers and professional operators to the varied uses and application possibilities of adhesives. Whether manufacturers of adhesives, sealants and sealing compounds or suppliers of dosing and application installations – the Bondexpo is the only sector platform worldwide and brings together suppliers and users. While a thoroughly worked-out glossary ensures the necessary “grip keeps feet on the ground”, a selection of peripheral seminars and expert lectures guarantees interesting and comprehensive information is at hand.



Online-Ordering-System
Online-Order-Service
 
Sonderschau klebtechnische Weiterbildung
Sonderschau klebtechnische Weiterbildung (Bondexpo)
 
 
at the same time takes place:
Motek
 
Event dates
22.09.2008 – 25.09.2008,
New Exhibition Centre Stuttgart
21.09.2009 – 24.09.2009,
New Exhibition Centre Stuttgart
 
Accomodations
 
product piracy
Produktpiraterie (Bondexpo)